Engineered Thermal Management for High-Density Electronics
Gap pads, gap fillers, phase-change materials and thermal greases — 1 to 6 W/mK, validated for AI servers, EV battery packs and power modules.
Twenty years of
thermal engineering
We formulate, test and manufacture thermal interface materials in-house. Every batch ships with thermal conductivity, hardness and dielectric strength data, so your design review does not depend on a datasheet alone.
D-U-N-S® registered, audited annually
Quality management, environmental compliance and material traceability reviewed by third parties.
Years of continuous thermal material development.
Square meters of material shipped worldwide.
Materials for every interface
Silicone Gap Pad 3.0 W/mK
Soft compressible pad for uneven surfaces, 0.5–10 mm.
Produkte ansehenDispensable Gap Filler 4.5 W/mK
High-throughput dispensing for battery modules and power stages.
Produkte ansehen
Phase Change Material 6.0 W/mK
Low thermal resistance after phase change at 45–60 °C.
Produkte ansehenData center, automotive, power electronics and consumer device programmes, from prototype to mass production.
Trusted by engineering teams
They replaced a two-vendor setup with one qualified material and shipped the validation report with the first batch. Thermal resistance dropped and our line yield went up.
Need a thermal solution?
Send your interface, power density and thickness budget — we reply with a material recommendation and samples within 24 hours.